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Adhesive
Bonding in Photonics Assembly
and Packaging
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B.
G. Yacobi
University
of Toronto, Toronto, CANADA
M. Hubert
Exfo
Photonic Solutions Inc., Mississauga, CANADA |
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July
2003
ca.200 pages, Hardcover
ISBN: 1-58883-019-5
US$249.00 |
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| DESCRIPTION
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| Adhesive
Bonding in Photonics Assembly and Packaging
deals with basic principles and the most up to date
technology of adhesive bonding used for photonics assembly and
packaging. Adhesive bonding is extensively employed in a wide
variety of applications in microelectronics and photonics assemblies
and packaging, manufacturing of optoelectronic and fiber-optic
components, and of medical devices. For such a wide variety of
applications, it is important to identify and develop compatible and
reliable adhesive bonding techniques targeting specific
applications. Photocuring of adhesives is becoming one of the most
preferred methods due to the advantages related to the capabilities
of instant cure, cure-on-demand, increased production speed, and
ease of automation. It is critical to understand the adhesion,
optical, thermal, mechanical and chemical properties of such
adhesives. The main objective of this book is to provide a complete
coverage of adhesive bonding used in photonics assembly and
packaging. |
| CONTENTS |
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Chapter 1.
Introduction
Chapter 2. Photonics Components,
Assemblies, and Devices
Chapter 3. Fundamentals of
Adhesive Bonding
Chapter 4. Types of Adhesives
Chapter 5. Photopolymerization Techniques
Chapter
6. Applications of Adhesive Bonding in Photonics
Chapter
7. Issues Related to Optical Adhesive Bonding
Chapter
8. Future Directions and Developments |
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| KEY
FEATURES |
- An excellent reference
source on adhesive bonding for optical and photonics components
and assemblies
- Description of optical
and photonics components and assemblies.
- Summary of the basic
principles of adhesive bonding, types of adhesives and
applications
of adhesives.
- Description of the
processes and methods related to optical radiation curing.
- Applications of
adhesive bonding in assembling photonics structures and devices
- The issues related to
the reliability and degradation of optical adhesive bonding
- Description of properties of adhesives
that determine their applications, the importance of design
considerations related to specific optical assemblies, issues
related to cleanliness and contamination removal, and the
stresses, degradation and reliability.
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| READERSHIP |
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This book should be useful for students,
scientists, engineers and professionals working in the areas of
optoelectronic packaging, photonic devices, semiconductor
technology, materials science, polymer science, electrical and
electronics engineering. This book could be used for one semester
course on adhesives for photonics packaging designed for both
undergraduate and graduate engineering students.
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