Adhesive Bonding in Photonics Assembly
and Packaging

B. G. Yacobi
University of Toronto, Toronto, CANADA
M. Hubert
Exfo Photonic Solutions Inc., Mississauga, CANADA
    July 2003
ca.200 pages, Hardcover
ISBN: 1-58883-019-5
Adhesive Bonding in Photonics Assembly and Packaging deals with basic principles and the most up to date technology of adhesive bonding used for photonics assembly and packaging. Adhesive bonding is extensively employed in a wide variety of applications in microelectronics and photonics assemblies and packaging, manufacturing of optoelectronic and fiber-optic components, and of medical devices. For such a wide variety of applications, it is important to identify and develop compatible and reliable adhesive bonding techniques targeting specific applications. Photocuring of adhesives is becoming one of the most preferred methods due to the advantages related to the capabilities of instant cure, cure-on-demand, increased production speed, and ease of automation. It is critical to understand the adhesion, optical, thermal, mechanical and chemical properties of such adhesives. The main objective of this book is to provide a complete coverage of adhesive bonding used in photonics assembly and packaging.


Chapter 1. Introduction
Chapter 2. Photonics Components, Assemblies, and Devices
Chapter 3. Fundamentals of Adhesive Bonding
Chapter 4. Types of Adhesives
Chapter 5. Photopolymerization Techniques
Chapter 6. Applications of Adhesive Bonding in Photonics
Chapter 7. Issues Related to Optical Adhesive Bonding
Chapter 8. Future Directions and Developments

  • An excellent reference source on adhesive bonding for optical and photonics components
    and assemblies
  • Description of optical and photonics components and assemblies.
  • Summary of the basic principles of adhesive bonding, types of adhesives and applications
    of adhesives.
  • Description of the processes and methods related to optical radiation curing.
  • Applications of adhesive bonding in assembling photonics structures and devices
  • The issues related to the reliability and degradation of optical adhesive bonding
  • Description of properties of adhesives that determine their applications, the importance of design considerations related to specific optical assemblies, issues related to cleanliness and contamination removal, and the stresses, degradation and reliability.

This book should be useful for students, scientists, engineers and professionals working in the areas of optoelectronic packaging, photonic devices, semiconductor technology, materials science, polymer science, electrical and electronics engineering. This book could be used for one semester course on adhesives for photonics packaging designed for both undergraduate and graduate engineering students.


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