An Open-Access Peer-Reviewed Journal ISSN: 2158-5849 (Print); EISSN: 2158-5857 (Online). Copyright © 2000- American Scientific Publishers. All Rights Reserved. |
 |
| Submit your manuscript via MsTracker |
| |
|
EDITORS-IN-CHIEF |
| ASSOCIATE
EDITORS Hui Chen, Southwest Jiaotong University, China Advanced welding and connection, laser processing, 3D printing, coating technology, metalllic materials Wei Chen, Department of Physics, The University of Texas at Arlington, USA Nanomaterials, phosphors, nanomedicine, sensing technology Xuefeng Guo, Nanjing University, China Green catalysis; nanocatalyst; single-atom catalyst; supercapacitors Woo-Sik Kim, Kyung Hee University, South Korea Crystallization; crystal growth; polymorphs; deracemization He Li, Chengdu University of Information Technology, China Functional nanomaterials; biosensors; drug delivery; nanomedicine Song Li, Hunan University of Technology, China Molecular diagnostics; nanobiotechnology; biosensors Yiwen Li, Sichuan University, China Polymers, biomaterials, soft matter, composites, hybrid materials Gang Liu, Xiamen University, China Biomaterials; molecular imaging; nanomedicine Lingyun Liu, University of Akron, USA Interface chemistry; polymers; biomaterials, biosensors; drug delivery; hydrogels Zhengchun Liu, Central South University, China Nanocarriers; nanomedicine; biosensors, biochips Haobo Pan, Shenzhen Institute of Advanced Technology, China Biomaterials, tissue engineering, nanostructures, materials chemistry, stem cell Xuping Sun, University of Electronic Science and Technology of China, China Energy & environmental electrocatalysis, water splitting, artificial nitrogen fixation Chuan gui Wu, University of Electronic Science and Technology of China, China Electronic ceramic materials, thin film materials, 2D materials Jun Wu, Sun Yat-sen University,China Biomaterials, drug delivery, tissue engineering, nanomedicine Bin Yan, SichuanUniversity, China Bio interfacial interactions; Bioinspired polymeric materials; nanomedicine Xin Yan, Beijing University of Posts and Telecommunications, China 2D materials; metamaterials; electronics; photonics; neuromorphic devices; sensors Hu Yang, Virginia Commonwealth University, USA Biomaterials; drug delivery; nanomedicine; polymeric materials Mingli Yang, Sichuan University, China Computational materials, electronic, optical, magnetic properties, 3D materials Su-Chul Yang, Dong-A University, South Korea Nanomaterials; ferroelectrics; magnetism; sensors; energy harvesting; health monitoring Haijun Yu, Chinese Academy of Sciences, Shanghai, China Drug delivery; gene delivery; cancer therapy; immunotherapy Yuanjin Zhao, Southeast University, China Biomaterials; microfluidics; organ-on-a-chip; hydrogel Zijian Zhou , Xiamen University, China Bionanotechnology; biomaterials; biomedical engineering |
| EDITORIAL
ADVISORY BOARD Lulu Cai, University of Electronic Sscience and Technology of China, China Han Chen, Hunan University of Technology, China You Rong Duan, Shanghai Cancer Institute, Shanghai Jiao Tong University, China Zhangqi Feng, Nanjing University of Science and Technology, China Shaozhi Fu, Southwest Medical University, China Muhammad Huda, The University of Texas at Arlington, USA Peng Jinrong, Sichuan University, China Huiyu Liu, Beijing University of Chemical Technology, China Zhiyang Li, Nanjing University, China Anton V. Naumov, Texas Christian University, USA Ramaswam Sammynaiken, University of Saskatchewan, Canada Fugen Wu, State Key Laboratory of Biological Electronics, Southeast University, China Yao Wu, Sichuan University, China Meng Xianwei, Technical Institute of Physics and Chemistry, CAS, China Li Xingyi, Wenzhou Medical University,China Shancheng Yan, Nanjing University of Posts and Telecommunications, China Zhi Mou Yang, Nankai University, China Qian Yang, Chengdu Medical College, China Zhiqiang Yu, Southern Medical University, China Liu Yuanfa, Dalian Polytechnic University, China Joe R. Zhao, Tri-Y Environmental Research Institute, Vancouver, Canada Xin Zhang, National Key Laboratory of Biochemical Engineering, Chinese Academy of Sciences, China |
|
Terms and Conditions Privacy Policy Copyright © 2000- American Scientific Publishers. All Rights Reserved. |