ISSN: 1546-1998 (Print): EISSN: 1546-2005 (Online)
Copyright © 2000- American Scientific Publishers. All Rights Reserved.
EDITOR-IN-CHIEF
Dr. Patrick GIRARD
Laboratory of Informatics, Robotics and
Microelectronics of Montpellier (LIRMM)
161 rue Ada, 34392 Montpellier cedex 05, FRANCE
Tel.: (+33) 467 418 629 Fax: (+33) 467 418 500
Email: girard@lirmm.fr
EDITORIAL BOARD
E. Acar, CLK Design Automation, USA
A. J. Acosta, University of Sevilla, Spain
E. Alarcon, UPC Barcelona, Spain
M. Alioto, National University of Singapore, Singapore
B. M. Al-Hashimi, University of Southampton, UK
Mohab H. Anis, The American University in Cairo, Egypt
M. Badaroglu, Qualcomm Technologies Inc., Belgium
S. Badrudduza, NXP Semiconductors, USA
M. J. Bellido, University of Sevilla, Spain
L. Benini, University of Bologna, Italy
S. Bhunia, University of Florida, USA
E. I. Boemo, University of Autonoma Madrid, Spain
W. Burleson, University of Massachusetts Amherst, USA
Y. Cao, Arizona State University, USA
M. Chan, Hong Kong University of Science & Technology, China
N. Chang, Seoul National University, South Korea
D. Chen, University of Illinois, Urbana-Champaign, USA
K. Choi, Seoul National University, South Korea
V. De, Intel Corporation, USA
W. Dehaene, KU Leuven, Belgium
J. Di, University of Arkansas, Fayetteville, USA
Y. Fei, Northeastern University, USA
E. G. Friedman, University of Rochester, USA
A. García-Ortiz, University of Bremen, Germany
K. Ghose, State University of New York, Binghamton, USA
S. Ghosh, Pennsylvania State University, USA
J. Gu, Northwestern University, USA
T. Guha Neogi, Global Foundries, USA
E. Guidetti, STMicroelectronics Inc., Switzerland
Y. Ha, ShanghaiTech University, China
J. Haid, Infineon Technologies, Austria
J. Henkel, University of karlsruhe, Germany
M. Hirech, Synopsys, USA
T. Ishihara, Kyoto University, Japan
N. Jha, Princeton University, USA
A. K. Jones, University of Pittsburgh, USA
J. Kim, Pohang University of Science and Technology, South Korea
J. Kim, Seoul National University, South Korea
M. Korb, ETZH, Switzerland
E. Kursun, IBM Thomas J. Watson Research Labs, USA
L. Lavagno, Cadence Design Systems, Italy
J. D. Legat, Universite Catholique de Louvain, Belgium
J. Li, University of Wisconsin-Madison, USA
P. Li, Texas A&M University, USA
X. Li, Chinese Academy of Sciences, Beijing, China
T.T. Liu, National Taiwan University, Taiwan
C. Lichtenau, IBM Research Labs., Germany
A. J. Lopez-Martin, University of Navarra, Spain
C. Lu, Southern Illinois University Carbondale, USA
E. Macci, Politecnico di Torino, Italy
Y. Manoli, University of Freiburg, Germany
P. Mattavelli, University of Padova, Italy
S. Mohanty, University of North Texas, Denton, USA
N. Muralimanohar, HP Labs, USA
N. Naganathan, Avago Technologies, USA
J. L. Nagel, CSEM, Switzerland
V. Narayanan, Pennsylvania State University, USA
S. Nazarian, University of Southern California, USA
W. Nebel, University of Oldenburg, Germany
W. T. Ng, University of Toronto, Canada
B. Nikolic, University of California at Berkeley, USA
V. G. Oklobdzija, University of California Davis, USA
R. Panda, Oracle America Inc., USA
B. C. Paul, GlobalFoundries, USA
M. Pedram, University of Southern California, USA
G. Pillonnet, CEA-LETI, France
J. Pineda de Gyvez, NXP Semiconductors, The Netherlands
C. Psychalinos, University of Patras, Greece
A. Raghunathan, Purdue University, USA
C. P. Ravikumar, Texas Instruments, India
S. Reda, Brown University, USA
M. Renaudin, TIEMPO SAS, France
G. A. Rincón-Mora, Georgia Institute of Technology, USA
K. Roy, Purdue University, USA
A. Rubio, UPC Barcelona, Spain
J.M. Sallese, EPFL, Switzerland
M. Sarrafzadeh, UCLA, USA
O. Sentieys, ENSSAT University of Rennes, France
L. Shang, University of Colorado at Boulder, USA
R. Singh, Clemson University, USA
D. Soudris, National Technical University of Athens, Greece
M. R. Stan, University of Virginia, USA
N. T. Tchamov, Tampere University of Technology, Finland
M. Tehranipoor, University of Florida, USA
J. P. Teixeira, Institute of Systems and Computer Engineering, Portugal
N. A. Touba, University of Texas at Austin, USA
A. Tisserand, CNRS, France
A. Trivedi, University of Illinois at Chicago, USA
T. Tuan, Xilinx Research Labs., USA
A. Tyagi, Iowa State University, USA
K. Uchiyama, Hitachi, Ltd., Japan
X. Vera, Intel Labs, Spain
G. Y. Wei, Harvard University, USA
P. Wong, Stanford University, USA
H. Yang, Tsinghua University, China
J. Yao, Qualcomm Technologies Inc., USA
S. Yin, Tsinghua University, China
S. Yoo, Postech University, South Korea
H. Yu, Southern University of Science and Technology, China
Y. Zhang, Intel Corp., USA
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